copper bond
英 [ˈkɒpə(r) bɒnd]
美 [ˈkɑːpər bɑːnd]
黄铜焊接
双语例句
- This product is a compound coated wire, it made flom excellent bare copper flat wire covered with polyvinyl resin or other enamel as based coating and coated a special bond at surface.
本产品为复合线材以优良的裸铜线为导体以缩甲醛合成树酯漆或合成漆为绝缘层并在绝缘层外涂以胶粘剂。 - Therefore, it can be concluded that copper ( ⅱ)_ amine complexes bond and activate O 2, and has characteristic of model enzyme.
所以铜胺配合物键合并活化了O2，具有模拟酶的特征。 - With the increase of copper quantity in infiltration process, porosity reduces obviously, the interface bond strength increases and the materials properties become high.
随着熔渗量的增多，材料的孔隙度减小，硬颗粒与基体界面结合强度好，材料性能明显提高。 - In the investigation, the pyrophosphate direction copper plating technology was given, and bond intensity of plating layer was close to one of cyanide copper plating.
同时给出了结合强度可与氰化物电镀相近的铁基体上焦磷酸盐直接镀铜工艺。 - Characterization of cardanol-aldehyde condensation polymer containing copper-nitrogen coordinated bond
含铜氮配键腰果酚醛缩聚物的特性及表征 - The Study of Copper Alloy Cladding Sheet of the Compound Technology and Bond Mechanism
两种铜合金复合板带室温轧制成形工艺及结合机制的研究 - Acidic copper plating technology with high polish and high dispersibility of plating solution and high bond strength between film and substrate
高结合强度、高分散性光亮酸性镀铜工艺的研究 - Through analyzing oxygen content in the mix layer, it was concluded that the oxygen layer in the interface of copper layer/ iron substrate was the main cause of influencing the bond intensity between the plating layer and substrate.
通过对后期混合层中氧含量的分析，可得出镀铜层/铁基体界面含氧层的存在是影响电镀层与基体结合强度的主要原因的结论。 - Through copper infiltration and controlling the copper quantity, a kind of Iron-based P/ M material with uniform microstructure and high interface bond strength is obtained.
采用熔渗工艺并合理控制渗铜量，可获得组织均匀化、各相界面结合较好的铁基粉末冶金材料。 - Clad dressing disposal a large amount of copper, The utilization ratio of copper is low, interface with the mechanical bond, The device of hot-dip coating is complexity, the operation is difficult to control.
机械包覆法修整处置量较大，铜带利用率较低，界面结合为机械结合。熔铜浸渍法设备复杂，操作较难控制。 - This thesis consists of the following two parts: The first part is review containing two chapters. In the first chapter, the development of copper catalysis in C-N bond formation is briefly introduced.
本篇论文主要分为两大部分：第一部分综述包括两节：第一节简要介绍铜催化C-N键构筑的研究。